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Product Name: lapping machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Features & Applications :
Suitable for large production capacity.
Applicable products :
IC circuit board, silicon chip, precious stone, optic glass, ceramic sheet, ore-sintering component, valve pad, precision metal parts.
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Product Name: lapping machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Min. thickness of
processed object 0.1 m/m
Loading board No. 6
Revolutions of bottom
grinding disc 0 - 50 R.P.M.
Electrical equipment
(D.C) 220V, 1HP
Net weight (NW) 500 Kgs
Machine dimension
(L*W*H) 920 x 920 x 2200 m/m
Standard accessories Special attachment for
specific job. It is subject to change.

Features & Applications :

Applicable products :
IC circuit board, silicon chip, precious stone, optic glass, ceramic sheet,
ore-sintering component, valve pad, precision metal parts.
Product List     Company Profile  

Select
Product Name: lapping machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Features & Applications :
Suitable for large production capacity.
Applicable products :
IC circuit board, silicon chip, precious stone, optic glass, ceramic sheet,
ore-sintering component, valve pad, precision metal parts.
Product List     Company Profile  

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Product Name: multi-blade cutting machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Maximum object (L*W*H) 170 x 150 x 80 m/m
Electrically driving machine 220V, 5HP
Sawing and cutting stepless 0-140 times/ min
Cutting gravity pressure loading / lever
Sawing route 80-160 m/m, 10 steps
Gliding bed flat type, recycled gliding
Grinding pump 220V, 1/4HP, 4P
Machine dimension
(L*W*H) 2000 x 720 x 1000 m/m
Machine weight (NW) 1600 kgs
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Product Name: lapping machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Features & Applications :
1.With high accuracy, this machine can lap work piece to 0.2u-0.5u flatness, Rmax 0.1S roughness.
2.Work piece can lay on the lapping plate without using magnetic chuck. No deformity will be happened to work piece even the thickness of work piece is smaller than 0.2mm.
3.Any material of work piece will be available for lapping.
4.Workpiece of different shapes and various materials can be lapped simultaneously.
5.Flatness maintenance of lapping plate can also be treated while lapping.
Grinded objects :
IC circuit board, silicon chip, precious stone, optic gla
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Product Name: lapping machine
Company: Jing Yan Enterprise Co.   [Taiwan]
Company Type: Manufacturer
Product Description:
Grinding disc dia. 600 m/m
Max working object dia. 229 m/m
Min. working object
thickness 0.20 m/m
Surface precision 0.2 - 0.5 u
Disc RPM 0 - 60 R.P.M.
Main shaft (HP) 3 HP Stepless
Pump (HP) 1/8 HP
Auto controller (min) 60 min
Net weight (NW) 650 Kgs
Machine dimension
(L*W*H) 1050 x 1100 x 1800 m/m
Standard accessories Special attachment
for specific job. It is
subject to change
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