Product Description:
3 Axes servo motor drive (APS-618S/818S) Super precision vertical linear guideways 3 Axes ball screws (APS-618S/818S) Simple, easy-to-use CNC control Enhances overall efficiency Total thermal stability Unique safety features incorperated in the control
Product Description:
An introduction to wafer grinding
The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafe
Product Description:
Joen Lih Hi-Precision CNC profile grinders are designed to meet current and future grinding requirements. The machines are engineered and manufactured to the highest industry standards starting from the raw castings right up through quality testing. This ensures optimal surface grinding accuracy and finish. Our goal is to exceed customer expectations for quality and investment.
Product Description:
The maximum grinding length 365mm 14.3" The maximum grinding width 150mm 6" Motor of grinding wheel 0.75Kw2p Motor for dust collection 0.4Kw2p
Product Description:
The maximum grinding length 470mm 10.50" The maximum grinding width 160mm 6.30" Distance from center of grinding wheel to workingsurface 400mm 15.75" Motor of grinding wheel 0.75Kw2p Motor for dust collection 0.4Kw2p
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