Product Description:
Chips are loaded automatically and clipped in the silicon rubber jaws of steel strip. Dipping is continuously running. Dip one side of chip and let it dried finish; then dip other side and then dried out. Two positions for dipping, and dipping plate has cooling device with temperature controlling. Heating device: 1. Preheating device; 2. Hot air heating Correcting mechanism: 1. Central correcting; 2. Position correcting The device of 90 degree rotation and position for chips. CCD monitor, 2 sets Dryer with temperature controlling, 2 sets Speed of steel belt, and vibration frequ
Product Description:
A. Specification: 1. Thin Carrier Plate System: (1) Thin Carrier Plate 280(L)*180(W) m/m (2) Thin Carrier Plate model fits for 0201. 0402. 0603. 0805~1206 chip sizes.
B. Function
Designed specifically for thin carrier plates.
Equipped with a vacuum pump to suck up thin carrier plate.
Thin carrier plate are put manually. The platform of vacuum plate is with position function.
The vacuum plate which has features of high steel rigidity and high accuracy is designed to fit 0201 or larger chips. Remove falling down chips automatically. Dipping unit equipped with
Product Description:
A. Functions (1) The function of paste roller mechanism : Equipped with 4 sets of paste roller mechanism. Even film thickness is obtained by means of micro-adjustment. Paste roller has fine grooves for paste to be adhered easily.
(2) Servo Termination head mechanism : Equipped with 4 sets of servo dipping head mechanism. There is a termination roller on top head of the paste roller. The function is to adhere the paste from the paste roller. Termination head can be moved up-down, right-left and forward-backward. The downward pressure of termination roller can be micr
Product Description:
Functions and Specifications A. Functions LGTM-2009 : Carrier plate is placed on and retreated back on the same side. LGTM-2009G1 : JIG plate or carrier plate is placed on and retreated back on the same side. LGTM-2009G2 : JIG plate or carrier plate is placed on one side, plate ejects on the other side which dipping is finished. LGTM-2009C2 : Carrier plate is placed on one side, and carrier plate ejects on the other side which dipping is finished Paste is dipped on chips automatically. Use doctor blade and the steel belt to coat paste on the steel belt evenly. With the functio
Product Description:
(1) The function of dipping unit The dipping unit is equipped with 2 sets of gripper. Use grippers to clip the carrier plate when it moves down to dip. With the option of first leveling then dipping or first dipping then leveling. With the option of first dipping or secondary dipping. Can select non-blotting dipping or 9-time blotting. High rigidity design, best accuracy and stability. Use HMI to read/write parameter in controlling of the speed and position of the dipping unit.
(2) The function of film-doctor blade The up/down motion of doctor blade is controlled by se
Product Description:
A. Transfer Mechanism : Dryer : Drived by chain Mechanism Load plate : 110 pieces a set including 1 mother plate
B. Monitor Unit (option) : Displayer : 17" TFT-LCD, auto layout and switch (can be set fix or switch ) CCD : 5 sets Displayer bracket : Enclosed-type, baking enamel treatment, with acrylic
C. Control Unit : Operation panel (HMI) : FUJI 17" Color Touch Panel human-machine interface Control system : KOYO PLC
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